Investigation of Combined Thermal Performance of Thermoelectric Cooler (TEC) and Heat Pipe for Electronic Cooling Review

Abstract

In our day-to-day lives, we are surrounded by lots of electronic devices. Every electronic device uses an integrated circuit, such as a small chip made of semiconductor materials, with many transistors, capacitors, and resistors. During the operation of an electronic device, a more significant amount of heat is generated in a small area. This excessive heat generated is responsible for around 55% of the failure of electronic devices. It is required to remove this excessive heat within a short period to protect the electronic device & enhance the life span of the electronic device. Heat pipes are passive cooling devices that use the phase change of a working fluid to transfer heat efficiently from a hot area to a more relaxed area. The heat pipe has the potential for practical use in electronic cooling, with its advantages. The thermo-electrical module has the capacity and ability to transfer the heat from the colder side to the hotter side for cooling electronic devices. It gives scope to study and investigate the integration of both cooling systems as heat pipe & Thermoelectric Cooler (TEC.) The module with a heat sink and fan combines the advantages of a heat pipe and a Thermoelectric module and develops a better cooling system for electronic devices.