Thermal Analysis and Reliability Assessment of RF MEMS Switches
Keywords:
Radio frequency, RF MEMS, Stiction, Thermal analysis, Thermal modellingAbstract
Radio Frequency Micro-Electro-Mechanical Systems (RF MEMS) switches are widely adopted in reconfigurable communication systems due to their low insertion loss, high isolation, and superior linearity. However, their performance and reliability under thermal stress remain critical challenges. This study presents a comprehensive thermal analysis and reliability assessment of RF MEMS switches under different operating conditions. Finite Element Method (FEM)-based thermal simulations were performed to evaluate temperature distribution, mechanical deformation, and thermal-induced failure modes. The reliability analysis focused on contact degradation, stiction, and fatigue due to cyclic thermal loading. The results reveal critical design limitations and suggest thermal management strategies to enhance operational lifespan.
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